Fresh leavened dough remains active inside the packaging. The yeast fungi contained in the dough generate gases and thus cause the dough to rise. Depending on the storage temperature, the increase in volume can be considerable.
The WICOVALVE® that was developed explicitly for this application also allows the gases to escape, safeguarding the integrity of the packaging.
WICOVALVE® for dough are available for heat-sealing and ultrasonic welding.